lenovo high density server
Latest Models lenovo high density server Pricelist, lenovo high density server Dealers in hyderabad, telangana
LENOVO THINKSYSTEM SD665N V3 1U SERVER
- Sever Brand: Lenovo
- Server Product: ThinkSystem SD665N V3 Server
- Form Factor: Full-wide 1U tray; 1 node+GPUs per tray
- Chassis: DW612S Enclosure (6U)
- Processor Structure: 1x or 2x 4th Generation AMD EPYC Processors per node
- RAM : Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray
- I/O Expansion: NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
- Acceleration: NVIDIA HGX H100 4-GPU with 4x NVLink connected SXM5 GPUs
- Storage: Up to 2x 2.5 NVMe SSDs (7mm height) or 1x 2.5 NVMe SSDs (15mm height) per node, Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
- RAID Support: OS Software RAID
- Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
- Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
- Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
- Front access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
- Rear access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
- Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy
- Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature
- OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.
- Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
LENOVO THINKSYSTEM SD650N V3 1U SERVER
- Sever Brand: Lenovo
- Server Product: ThinkSystem SD650N V3 Server
- Form Factor: Full-wide 1U tray; 1 node+GPUs per tray
- Chassis: DW612S Enclosure (6U)
- Processor Structure: Two 5th Gen Intel Xeon Scalable processors per tray, or 2x Intel Xeon CPU Max Series processors per tray
- RAM: Up to 2TB using 16x 128GB 5600MHz TruDDR5 RDIMM slots per tray
- I/O Expansion: NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
- Acceleration: NVIDIA HGX H100 4-GPU with 4x NVLink connected SXM5 GPUs
- Storage: Up to 2x 2.5 NVMe SSDs (7mm height) or 1x 2.5 NVMe SSDs (15mm height) per node, Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
- RAID Support: OS Software RAID
- Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
- Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
- Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
- Front Access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
- Rear Access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
- Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy
- Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature
- OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit: lenovopress.com/osig for more information.
- Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
LENOVO THINKSYSTEM SD665 V3 1U SERVER
- Sever Brand: Lenovo
- Server Product: ThinkSystem SD665 V3 Server
- Form Factor: Full-wide 1U tray; 2 nodes per tray
- Chassis: DW612S Enclosure (6U)
- Processors Structure: 2x 4th Generation AMD EPYC Processors per node
- RAM: Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray
- I/O Expansion: Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported.
- Internal Storage: Up to 4x 2.5-inch NVMe SSDs (7mm height) or 2x 2.5-inch NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
- RAID Support: OS Software RAID
- Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
- Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
- Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
- Front Access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
- Rear Access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
- Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium)Supports up to N+1 redundancy
- Cooling Design: Direct Water Cooling at the heat source with up to 50C inlet water temperature
- OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.
- Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
LENOVO THINKSYSTEM SD650I V3 6U SERVER
- Sever Brand: Lenovo
- Server Product: ThinkSystem SD650I V3 High Density Server
- Form Factor/Height: 6U rack-mount with 6 trays
- Processor Structure: 2x 4th Gen Intel Xeon Scalable processors per tray or 2x Intel Xeon CPU Max processors per tray
- Ram: Up to 2.0TB using 16x 128GB 4800 MHz TruDDR5 RDIMMs per tray
- Storage: Up to 4x 7mm or 2x 15mm U.2/SATA, no drive/backplane choice and 1 x liquid cooled M.2 NVMe SSD, providing both the boot drive and storage function SW RAID and Intel VROC for Intel drives only
- NIC: 2 x SFP28 25Gb LOM, NCSI (10Gb capable); 1x RJ45 1GbE, NCSI
- PCIe: 2x x16 PCIe Gen5 LP per tray
- Power Supply: Up to 9x air CFF v4 (2400W PT, 2600W TT); Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium
- Cooling System: Direct Water Cooling with up to 50C inlet water temperature
- Management: Lenovo XClarity Controller (XCC) and Lenovo Intelligent Computing Orchestration (LiCO)
- OS Support: Red Hat Enterprise Linux, SUSE Linux Enterprise Server
- Acceleration: Four Intel Data Center GPU Max <=600W TDP
- Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
LENOVO THINKSYSTEM SD650 V3 1U SERVER
- Sever Brand: Lenovo
- Server Product: ThinkSystem SD650 V3 High-Density Server
- Form Factor: Full-wide 1U tray (two SD650 V3 nodes per tray, six per DW612S Enclosure)
- Chassis: DW612S Enclosure (6U)
- Processors Structure: Two 4th Gen Intel Xeon Scalable processors per node, or 2x 4th Gen Intel Xeon CPU Max series processors with HBM per node; 2x nodes per 1U tray
- RAM : Up to 2.0TB using 16x 128GB 4800 MHz per node
- I/O Expansion: Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported.
- Internal Storage: Up to 4x 2.5 SATA/NVMe SSDs (7mm height) or 2x 2.5 NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
- RAID Support: Onboard SATA controller with SW RAID or Intel VROC
- Network Interface: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
- Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
- Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
- Front access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
- Rear access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
- Power Supply: Up to 9x air CFF v4 (2400W PT, 2600W TT) ; Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium; N+1 redundancy (only air-cooled / without acceleration on DWC)
- Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature
- OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.
- Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
LENOVO THINKSYSTEM SD650N V2 6U SERVER
- Sever Brand: Lenovo
- Server Product: ThinkSystem SD650N V2 High Density Server
- Form Factor/Height: 6U rack-mount with 6 trays
- Processor Structure: 2x 3rd Gen Intel Xeon Scalable processors per node
- Memory: Up to 2.0TB using 16x 128GB 3200MHz TruDDR4 RDIMMs per tray
- Storage: 2x 2.5-inch slim SATA / NVMe U.2 SSD and 2x M.2 SATA SSD SW RAID and Intel VROC for Intel drives only
- NIC: 1x SFP28 25Gb LOM, NCSI 1x RJ45 1GbE, NCSI
- PCIe: 2x x16 PCIe Gen4 LP per tray
- Power Supply: 6/9 N+1 redundant hot-swap PSUs (up to 2400W Platinum)
- Cooling System: Direct Water Cooling with up to 50C inlet water temperature
- Management: Lenovo XClarity Controller (XCC) and Lenovo Intelligent Computing Orchestration (LiCO)
- OS Support: Red Hat Enterprise Linux, SUSE Linux Enterprise Server Tested on CentOS
- Acceleration: NVIDIA HGX A100 4-GPU with 4x NVLink connected SXM4 GPUs
- Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
LENOVO THINKSYSTEM SD530
The density of blades, the economics of rack systems
- Modular I/O shuttle design
- Supports HPC and enterprise workloads
- Superior storage performance
- Add-on tray supports two GPUs per node
- XClarity Management
Features
Highlights
- Ultra-dense 2U, 4-node platform delivers more in less space
- Extreme compute capability, ready to adapt when you are
- Ultra-agile shuttle design provides the modularity to transform
Ready for what's next
- Easily adjusting to new environments and different conditions has been the dictionary definition of adaptability. Now, Lenovo ThinkSystem SD530 redefines IT adaptability. SD530 is a single platform designed to excel not only at critical enterprise workload environments (such as virtualization, hyperconverged infrastructure, and cloud), but also at high performance computing (HPC) and artificial intelligence (AI). Combining the efficiency and density of blades with the value and simplicity of rack-based servers, SD530 could very well be the most adaptable server on Earth.
- ThinkSystem SD530 consists of a modular 2U Lenovo D2 Enclosure containing up to four front-access SD530 servers (nodes). Each node, incorporating two powerful Intel® Xeon® processor Scalable family CPUs, achieves up to 56 percent faster performance than the previous generation. The innovative design of the D2 enclosure provides the flexibility to meet varied needs in the modern data center. For example, multiple D2 Enclosures can be easily daisy-chained together and then managed as a single unit, which reduces cabling costs by as much as 92 percent, compared to the previous generation*, and simplifies administration.
LENOVO THINKSYSTEM SD650 HIGH DENSITY SERVER
Direct water cooling for a highly efficient data center
- Delivers greater performance than aircooled servers
- Provides greater rack and data center density than air-cooled servers
- Dramatically reduces energy costs
- Supports high-speed EDR IB and Omni Path fabrics
- Supports standard SSDs, NVMe SSDs, and M.2 boot SSDs, for even greater storage flexibility
Features
Highlights
- Direct water cooling design removes up to 90% of server heat from the rack, keeping processors up to 20°C cooler. This enables the processors to continually run in "turbo" mode, greatly increasing system performance.
- Uses incoming (inlet) water for cooling, reducing or eliminating the need for expensive data center evaporative chillers. This saves both equipment costs and footprint space.
- Exiting (outlet) water can be used to heat campus buildings to reduce overall energy use, saving you even more on energy costs.
Innovative design
The Lenovo ThinkSystem SD650 dual-node tray is designed for high performance computing (HPC), large-scale cloud, and heavy simulations. It supports workloads from technical computing to grid deployments to analytics and is ideally suited for fields such as research, oil and gas, and engineering. The SD650's unique water-cooling technology provides many key benefits. Compared to other technology, the SD650's direct water cooling:
- Reduces data center energy costs by 40%
- Increases system performance
- Delivers 90% heat removal efficiency*
- Creates a quieter data center
- Enables data center growth without adding CRACs
Maximum performance and management
- Designed to run the highest core-count Intel Xeon Scalable Family processors, the SD650 powers through demanding HPC workloads. Because water cooling removes more heat, CPUs can run in “turbo” mode nonstop, getting up to 10% greater performance from the CPU. For even greater system performance, the SD650 uses 2667MHz DDR4 memory and supports NVMe storage, high-speed EDR InfiniBand, and Omni Path adapters.
- The SD650 is managed by Lenovo Intelligent Computing Orchestrator (LiCO), a powerful management suite with an intuitive GUI that helps to easily manage large HPC cluster resources and accelerate development of AI applications.